DISCO grinding：DFG8830

DFG8830

Grindingmethod,-,In-feedgrindingwithwaferrotation.Grindingwheel,-,Φ300mmDiamondWheel.Spindle,Ratedoutput,kW,6.3.。其他文章還包含有：「DFG8540|Grinders」、「DFG8540」、「Grinding」、「Poligrind」、「TAIKOProcess|Grinding」、「Ultra-ThinGrinding|Grinding」、「研磨」

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DFG8540 | Grinders

https://www.disco.co.jp

Supports advancements for thinner wafers · Thin grinding (100 µm). Advanced handling systems and design features facilitate high yield for thin wafer grinding.

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DFG8540

https://www.disco.co.jp

Specifications ; Grinding Wheels, -, Φ200 mm Diamond Wheel ; Spindle, Rated output, kW, 4.2.

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Grinding

https://www.disco.co.jp

DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions.

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Poligrind

https://www.disco.co.jp

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TAIKO Process | Grinding

https://www.disco.co.jp

When grinding the wafer, the TAIKO process leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner ...

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Ultra-Thin Grinding | Grinding

https://www.disco.co.jp

DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions.

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研磨

https://www.disco.co.jp

High quality sapphire processing · Reducing wafer edge chipping by optimizing the fine grinding amount · Improving TTV by Planarization of backgrinding (BG) tape ...

DISCO grinding：DFG8830

DFG8830

DFG8540 | Grinders

DFG8540

Grinding

Poligrind

TAIKO Process | Grinding

Ultra-Thin Grinding | Grinding

研磨

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