DISCO grinding：Ultra-Thin Grinding | Grinding
Ultra-Thin Grinding | Grinding
DFG8540 | Grinders
https://www.disco.co.jp
Supports advancements for thinner wafers · Thin grinding (100 µm). Advanced handling systems and design features facilitate high yield for thin wafer grinding.
DFG8540
https://www.disco.co.jp
Specifications ; Grinding Wheels, -, Φ200 mm Diamond Wheel ; Spindle, Rated output, kW, 4.2.
DFG8830
https://www.disco.co.jp
Grinding method, -, In-feed grinding with wafer rotation. Grinding wheel, -, Φ300 mm Diamond Wheel. Spindle, Rated output, kW, 6.3.
Grinding
https://www.disco.co.jp
DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions.
Poligrind
https://www.disco.co.jp
PoligrindGrinding Wheels. 列印print ... 由第三方對敝司刀片進行刀刃再生處理的聲明 · What kind of company is DISCO? © 2020 DISCO Corporation. All rights reserved.
TAIKO Process | Grinding
https://www.disco.co.jp
When grinding the wafer, the TAIKO process leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner ...
研磨
https://www.disco.co.jp
High quality sapphire processing · Reducing wafer edge chipping by optimizing the fine grinding amount · Improving TTV by Planarization of backgrinding (BG) tape ...