BGBM process：厚銀製程Thick Ag Process 晶圓薄化FSM BGBM │ ...

厚銀製程Thick Ag Process 晶圓薄化FSM BGBM │ ...

厚銀製程(ThickAgProcess)流程.晶圓完成入站檢驗後(IQC)，按照客戶指示之種類及厚度進行靶材準備後，進入蒸鍍機(Evaporator)沈積金屬。完成金屬沈積(MetalEvaporation) ...。其他文章還包含有：「BGBM」、「FSM&BGBM」、「MOSFETWaferThinning-FSM」、「MOSFET晶圓後段製程(BGBM)」、「先進封裝製程WLCSP」、「功率MOSFET的FSM與BGBM製程改善」、「半導體製程保護解決方案」、「晶圓後段製程(BGBM)」、「製程服務」

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BGBM

https://www.lblusem.com

BGBM (Backside Grinding, Backside Metallization). Unique TBDB method of LB Lusem is applied to provide differentiated BGBM service. [ Spec & Target ]; Wafer ...

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FSM & BGBM

https://www.rayteksemi.com

BG Thinning ability: 12 inch wafer : Min. 175 um, 8inch wafer: Min. 150 um. Enhance metal adhesion by sputtering process. Provide Bumping (SnAg Bump), RDL (Cu/ ...

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MOSFET Wafer Thinning-FSM

https://www.istgroup.com

iST has recruited professional experts and implement advanced processing to assist you in completing wafer thinning and backside metallization (BGBM) in short ...

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