Cu whisker
「Cu whisker」熱門搜尋資訊
「Cu whisker」文章包含有:「AStudyofWhiskerFormationintheElectrodeposition...」、「AgandCuwhiskerformationinAg–Cu–Tealloys」、「CuwhiskerECSabstracts」、「GrowthbehavioroftinwhiskerandhillockonCuNiSnAg...」、「InvestigationofCuwhiskergrowthbymolecularbeam...」、「PartAWhiskerFormationonTinPlatedCubased...」、「Whisker(metallurgy)」、「WhiskergrowthundervariousstorageconditionsonaCu」
查看更多A Study of Whisker Formation in the Electrodeposition ...
https://iopscience.iop.org
Under certain conditions the electrolysis of acid copper sulfate between copper electrodes leads to formation of long filaments, or whiskers, of copper on the ...
Ag and Cu whisker formation in Ag–Cu–Te alloys
https://link.springer.com
Ag whiskers, Cu whiskers, and Ag + Cu whiskers are observed in Ag–Cu–Te alloys. They are polycrystalline and have a preferred growth orientation ...
Cu whisker ECS abstracts
https://www.electrochem.org
Classical whiskers are usually single crystal, straight with sharp tips, while fibrous copper deposits were polycrystalline of. Cu(111) and (200) orientations.
Growth behavior of tin whisker and hillock on CuNiSnAg ...
https://www.sciencedirect.com
Tin whisker was likely to grow from shallow surface grains on Cu/Ni/SnAg micro-bumps. Stress difference formed by oxidation and IMC reaction was the driving ...
Investigation of Cu whisker growth by molecular beam ...
https://www.degruyter.com
Previous experiments on a whisker growth in Si substrate/ thin carbon layer/Cu system show that a carbon-coated substrate surface is required ...
Part A Whisker Formation on Tin Plated Cu based ...
https://www.nxp.com
Sn-plating on Cu-base-material is prone to whiskers. Ni-underlayer will eliminate whisker risk. Cu-based leadframe @ RT. Whisker on Cu.
Whisker (metallurgy)
https://en.wikipedia.org
Metal whiskering is a phenomenon that occurs in electrical devices when metals form long whisker-like projections over time. Tin whiskers were noticed and ...
Whisker growth under various storage conditions on a Cu
https://www.researchgate.net
The characterization results obtained confirm that temperature cycling and isothermal storage favor the formation of whiskers on Sn-plated copper lead frames.