lintec s-75c
「lintec s-75c」熱門搜尋資訊
「lintec s-75c」文章包含有：「PeelingTapeforBGTape」、「Pressure」、「SSeries研磨用保護膠帶剝離用膠帶」、「晶圓撕膜膠帶forWaferDe」
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Peeling Tape for BG Tape
https://www.adwill-global.com
A special-purpose tape for removing back grinding tape with the Wafer Mounter RAD-2500 series and the BG Tape Remover RAD-3000 series.
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Pressure
https://patents.google.com
Next, a polypropylene film (manufactured by Lintec, Adwill S-75C) having a width of 50 mm and a length of 60 mm was prepared as a peeling tape.
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S Series 研磨用保護膠帶剝離用膠帶
https://www.lintec.com.tw
使用晶圓貼合機「RAD-2500系列晶圓貼合機」及「RAD-3000系列研磨用膠帶撕片機」進行表面保護膠帶剝除用的專用膠帶。 · 可與各種機台進行組合，能不損傷晶圓表面並能剝除表面 ...
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晶圓撕膜膠帶for Wafer De
https://tape-data.com
基材：PET. 膠系:亞克力特殊膠. 厚度：0.07（mm）. 顏色：透明. 豐富*長度： 根據客戶需求. 側著力:2.0↑ (g/25mm). 晶圓研磨後藍膜撕除. 已有多家封裝廠實績.