Die bonder Machine:AFC Plus
Die Bonding
https://www.besi.com
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach ...
Die Bonder
https://mrsisystems.com
A die bonder is a system that places a semiconductor device onto the next level of interconnection, whether it be a substrate or a board.
Die Bonder固膠機製程手臂發生異常?
https://www.goodtechnology.com
Die bonder,固膠機,在PCB板上固定晶片,由上片手臂將PCB料件送至定點,點膠手臂於晶片位置點膠,並且經過取片與鍵合過程為一週期。 Die bonding (黏晶)是半導體後段封裝 ...
Die Attach
https://www.besi.com
Besi offers a wide range of die attach systems based on leading-edge technology. The offering includes multi-chip bonders for advanced packaging, epoxy and soft ...
CoS Die Bonder: High-precision chip
https://amicra.semi.asmpt.com
This machine is capable to perform multi-die bonding of up to +/- 1.5µm@3s placement accuracy on singulated submounts by using eutectic bonding method ...
Die Bonder for research and development
https://finetech.de
Your vision brought to life Our R&D Bonders are ready to tackle the challenges of today and tomorrow.Flexible, accurate and retrofittable at all times.
Die bonder
https://www.directindustry.com
Find your die bonder easily amongst the 57 products from the leading brands (HANWHA, BESI, Panasonic, ...) on DirectIndustry, the industry specialist for ...
Manual & Semiautomatic Die Bonder Equipment ...
https://www.inseto.co.uk
Manual and semiautomatic die bonder equipment and die sort machines. Die bond and flip chip die bonding equipment for assembly of microeclectronic devices.