Die bonder Machine:Die Bonder固膠機製程手臂發生異常?
Die Bonder固膠機製程手臂發生異常?
Die Bonding
https://www.besi.com
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach ...
Die Bonder
https://mrsisystems.com
A die bonder is a system that places a semiconductor device onto the next level of interconnection, whether it be a substrate or a board.
AFC Plus
https://amicra.semi.asmpt.com
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as ...
Die Attach
https://www.besi.com
Besi offers a wide range of die attach systems based on leading-edge technology. The offering includes multi-chip bonders for advanced packaging, epoxy and soft ...
CoS Die Bonder: High-precision chip
https://amicra.semi.asmpt.com
This machine is capable to perform multi-die bonding of up to +/- 1.5µm@3s placement accuracy on singulated submounts by using eutectic bonding method ...
Die Bonder for research and development
https://finetech.de
Your vision brought to life Our R&D Bonders are ready to tackle the challenges of today and tomorrow.Flexible, accurate and retrofittable at all times.
Die bonder
https://www.directindustry.com
Find your die bonder easily amongst the 57 products from the leading brands (HANWHA, BESI, Panasonic, ...) on DirectIndustry, the industry specialist for ...
Manual & Semiautomatic Die Bonder Equipment ...
https://www.inseto.co.uk
Manual and semiautomatic die bonder equipment and die sort machines. Die bond and flip chip die bonding equipment for assembly of microeclectronic devices.