LFBGA：LGA

LGA

LGA(LandGridArrayPackage)是以BGA的封裝技術，沒有焊球進一步降低產品高度。LGA具有更薄更輕的封裝外形，它特別適用於要求高電氣性能的應用。。其他文章還包含有：「FBGA」、「LFBGA」、「LFBGA324」、「LFBGATFBGAHSBGA」、「PG-LFBGA」、「封裝服務」、「封裝服務」、「球柵陣列封裝」

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VFBGA

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FBGA

https://asekhsite.aseglobal.co

LFBGA, 1.20~1.70mm, Low Profile, Fine Solder Ball Pitch. TFBGA, 1.00~1.20mm, Thin Profile, Fine Solder Ball Pitch. VFBGA, 0.80~1.00mm, Very Thin Profile, Fine ...

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LFBGA

https://www.eesemi.com

The typical LFBGA ball pitch is 0.50 mm to 0.8 mm . A typical LFBGA is about 1.3 mm to 1.7 mm thick. Table 1. Properties of Some LFBGA's ...

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LFBGA 324

https://www.microchip.com

... Note: 324-Ball Low Profile Fine Pitch Ball Grid Array (2KX) - 16x16 mm Body [LFBGA]. D. E. A. B. C. D. E. F. G. H. J. K. L. M. N. P. R. T. U. V. A. B. C. D. E.

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LFBGATFBGAHSBGA

https://www.ose.com.tw

TFBGA 和LFBGA 这类的CSP芯片尺寸封装产品, 可满足进一步缩小尺寸及高脚数的需求，提供更大的设计空间及高密度封装应用的优势，包括标准和客制化产品。

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PG-LFBGA

https://www.infineon.com

Soldering Profile ... Nonhermetic Solid State Surface Mount Devices. Please visit https://www.jedec.org for more information. You also may be interested in our ...

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