LFBGA
「LFBGA」熱門搜尋資訊
FBGA
https://asekhsite.aseglobal.co
LFBGA, 1.20~1.70mm, Low Profile, Fine Solder Ball Pitch. TFBGA, 1.00~1.20mm, Thin Profile, Fine Solder Ball Pitch. VFBGA, 0.80~1.00mm, Very Thin Profile, Fine ...
LFBGA
https://www.eesemi.com
The typical LFBGA ball pitch is 0.50 mm to 0.8 mm . A typical LFBGA is about 1.3 mm to 1.7 mm thick. Table 1. Properties of Some LFBGA's ...
LFBGA 324
https://www.microchip.com
... Note: 324-Ball Low Profile Fine Pitch Ball Grid Array (2KX) - 16x16 mm Body [LFBGA]. D. E. A. B. C. D. E. F. G. H. J. K. L. M. N. P. R. T. U. V. A. B. C. D. E.
LFBGATFBGAHSBGA
https://www.ose.com.tw
TFBGA 和LFBGA 这类的CSP芯片尺寸封装产品, 可满足进一步缩小尺寸及高脚数的需求，提供更大的设计空间及高密度封装应用的优势，包括标准和客制化产品。
LGA
https://www.ose.com.tw
LGA(Land Grid Array Package)是以BGA的封裝技術，沒有焊球進一步降低產品高度。 LGA具有更薄更輕的封裝外形， 它特別適用於要求高電氣性能的應用。
PG-LFBGA
https://www.infineon.com
Soldering Profile ... Nonhermetic Solid State Surface Mount Devices. Please visit https://www.jedec.org for more information. You also may be interested in our ...
封裝服務
https://www.kyec.com.tw
京元電子提供各樣式的BGA封裝型式，包括：LFBGA (Low Profile Fine-Pitch BGA)、TFBGA (Thin Fine-Pitch BGA) 和Mini-BGA。 BGA封裝型式: 一站式封裝服務，包含以下封裝 ...
封裝服務
https://www.lingsen.com.tw
LFBGA Low Profile , Fine Pitch Ball Grid Array Package. LEAD COUNT, PACKAGE DIM. LEAD PITCH. View. 88 Ball. 8.0 x 6.0 mm. 0.65 mm ...
球柵陣列封裝
https://zh.wikipedia.org
LFBGA：Low-profile Fine-pitch Ball Grid Array，薄型細間距BGA。 MBGA：Micro Ball Grid Array，微型BGA。 MCM-PBGA：Multi-Chip Module Plastic Ball Grid Array ...