LFBGA：LFBGA 324

LFBGA 324

...Note:324-BallLowProfileFinePitchBallGridArray(2KX)-16x16mmBody[LFBGA].D.E.A.B.C.D.E.F.G.H.J.K.L.M.N.P.R.T.U.V.A.B.C.D.E.。其他文章還包含有：「FBGA」、「LFBGA」、「LFBGATFBGAHSBGA」、「LGA」、「PG-LFBGA」、「封裝服務」、「封裝服務」、「球柵陣列封裝」

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VFBGA

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FBGA

https://asekhsite.aseglobal.co

LFBGA, 1.20~1.70mm, Low Profile, Fine Solder Ball Pitch. TFBGA, 1.00~1.20mm, Thin Profile, Fine Solder Ball Pitch. VFBGA, 0.80~1.00mm, Very Thin Profile, Fine ...

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LFBGA

https://www.eesemi.com

The typical LFBGA ball pitch is 0.50 mm to 0.8 mm . A typical LFBGA is about 1.3 mm to 1.7 mm thick. Table 1. Properties of Some LFBGA's ...

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LFBGATFBGAHSBGA

https://www.ose.com.tw

TFBGA 和LFBGA 这类的CSP芯片尺寸封装产品, 可满足进一步缩小尺寸及高脚数的需求，提供更大的设计空间及高密度封装应用的优势，包括标准和客制化产品。

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LGA

https://www.ose.com.tw

LGA(Land Grid Array Package)是以BGA的封裝技術，沒有焊球進一步降低產品高度。 LGA具有更薄更輕的封裝外形，它特別適用於要求高電氣性能的應用。

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PG-LFBGA

https://www.infineon.com

Soldering Profile ... Nonhermetic Solid State Surface Mount Devices. Please visit https://www.jedec.org for more information. You also may be interested in our ...

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