Detaping：撕片機Detaping半導體製程、後工程

Auto De

https://www.csun.com.tw

Wafer Dimension: Diameter: 12″ Thickness: 0.3-2.0mm. Warpage: ±500um; Peeling Module: Peeling Size: 8″/12″ Tape Size: 50mm wide, Max 30mm (3″inner tube) ...

De

https://www.navcore.com.tw

Function. Touch Roller Type; Touch Plate Type; Heating head type; Vacuum Table Angle adjustment; Vacuum Table Heating; Peeling Tape Angle adjustment.

Fully Automatic Detaping System

https://www.jipal.com

Fully Automatic Detaping System. 商品簡述：. Key Features. Full auto tape peeling of QFN devices; Cater for both ambient & high temp. tape peeling up to 250 ...

Kinergy Corporation

https://www.jipal.com

Kinergy Corporation. 首頁 · 產品服務 · 半導體 · Kinergy Corporation · Full Automatic Buffing Machine · Fully Automatic Detaping System ...

大和產業科技

http://tw.abbatape.com

De-Taping Tape ABBA™. 大家都愛用 大和產業科技製造 值得信賴. 「撕保護膜膠帶」在製程中它緊緊黏著保護膜不脫落，撕除時可輕易乾淨的剝離保護膜不殘膠.

撕片膠帶

https://www.toyo-adtec.com.tw

機器學習如何應用在監測封裝設備上？

https://www.goodtechnology.com

晶圓前段封裝製程順序大致上為：Wafer In → Taping 貼膠→ Wafer Grinding 晶圓研磨→ De-Taping去膠→ Wafer Mount 上框→ UV UV上框→ Wafer Saw ...

研磨用表面保護膠帶

https://www.toyo-adtec.com.tw

(for after wafer Grinding process, easy to detaping), 500. FUB-150E-XX, PO, Transparent, 150, 20/30, 170/180, 7.50, 0.20, UV types