Detaping
「Detaping」熱門搜尋資訊
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「Detaping」文章包含有:「AutoDe」、「De」、「FullyAutomaticDetapingSystem」、「KinergyCorporation」、「大和產業科技」、「撕片機Detaping半導體製程、後工程」、「撕片膠帶」、「機器學習如何應用在監測封裝設備上?」、「研磨用表面保護膠帶」
查看更多![Auto De](https://api.multiavatar.com/Auto+De-taping+Machine.png?apikey=viVnb6N20jclO8)
Auto De
https://www.csun.com.tw
Wafer Dimension: Diameter: 12″ Thickness: 0.3-2.0mm. Warpage: ±500um; Peeling Module: Peeling Size: 8″/12″ Tape Size: 50mm wide, Max 30mm (3″inner tube) ...
![De](https://api.multiavatar.com/De-Taping+-+%E6%89%AC%E5%BC%88%E7%A7%91%E6%8A%80.png?apikey=viVnb6N20jclO8)
De
https://www.navcore.com.tw
Function. Touch Roller Type; Touch Plate Type; Heating head type; Vacuum Table Angle adjustment; Vacuum Table Heating; Peeling Tape Angle adjustment.
![Fully Automatic Detaping System](https://api.multiavatar.com/Fully+Automatic+Detaping+System+-+%E7%94%A2%E5%93%81%E6%9C%8D%E5%8B%99%7C+%E5%B7%A8%E6%B2%9B%E8%82%A1%E4%BB%BD%E6%9C%89%E9%99%90+....png?apikey=viVnb6N20jclO8)
Fully Automatic Detaping System
https://www.jipal.com
Fully Automatic Detaping System. 商品簡述:. Key Features. Full auto tape peeling of QFN devices; Cater for both ambient & high temp. tape peeling up to 250 ...
![Kinergy Corporation](https://api.multiavatar.com/Kinergy+Corporation+-+%E7%94%A2%E5%93%81%E6%9C%8D%E5%8B%99%7C+%E5%B7%A8%E6%B2%9B%E8%82%A1%E4%BB%BD%E6%9C%89%E9%99%90%E5%85%AC%E5%8F%B8.png?apikey=viVnb6N20jclO8)
Kinergy Corporation
https://www.jipal.com
Kinergy Corporation. 首頁 · 產品服務 · 半導體 · Kinergy Corporation · Full Automatic Buffing Machine · Fully Automatic Detaping System ...
![大和產業科技](https://api.multiavatar.com/%E5%A4%A7%E5%92%8C%E7%94%A2%E6%A5%AD%E7%A7%91%E6%8A%80-%E7%94%A2%E5%93%81%E7%A0%94%E7%99%BC%E6%95%B4%E5%90%88%E8%A8%AD%E8%A8%88%E8%A3%BD%E9%80%A0-+%E5%89%9D%E9%9B%A2%E8%86%A0%E5%B8%B6.png?apikey=viVnb6N20jclO8)
大和產業科技
http://tw.abbatape.com
De-Taping Tape ABBA™. 大家都愛用 大和產業科技製造 值得信賴. 「撕保護膜膠帶」在製程中它緊緊黏著保護膜不脫落,撕除時可輕易乾淨的剝離保護膜不殘膠.
![撕片機Detaping半導體製程、後工程](https://api.multiavatar.com/%E6%92%95%E7%89%87%E6%A9%9FDetaping%E5%8D%8A%E5%B0%8E%E9%AB%94%E8%A3%BD%E7%A8%8B%E3%80%81%E5%BE%8C%E5%B7%A5%E7%A8%8B.png?apikey=viVnb6N20jclO8)
撕片機Detaping半導體製程、後工程
https://en.well-orientation.co
撕片機Detaping · More Products · 鋼板檢查機 · 壓模機Auto-Mold System · AOI檢測機台 · UV解膠機 · 清洗機Cleaner · 植球機Ball Mount · 貼片機Taping.
![撕片膠帶](https://api.multiavatar.com/%E6%92%95%E7%89%87%E8%86%A0%E5%B8%B6.png?apikey=viVnb6N20jclO8)
撕片膠帶
https://www.toyo-adtec.com.tw
![機器學習如何應用在監測封裝設備上?](https://api.multiavatar.com/%E6%A9%9F%E5%99%A8%E5%AD%B8%E7%BF%92%E5%A6%82%E4%BD%95%E6%87%89%E7%94%A8%E5%9C%A8%E7%9B%A3%E6%B8%AC%E5%B0%81%E8%A3%9D%E8%A8%AD%E5%82%99%E4%B8%8A%EF%BC%9F.png?apikey=viVnb6N20jclO8)
機器學習如何應用在監測封裝設備上?
https://www.goodtechnology.com
晶圓前段封裝製程順序大致上為:Wafer In → Taping 貼膠→ Wafer Grinding 晶圓研磨→ De-Taping去膠→ Wafer Mount 上框→ UV UV上框→ Wafer Saw ...
![研磨用表面保護膠帶](https://api.multiavatar.com/%E7%A0%94%E7%A3%A8%E7%94%A8%E8%A1%A8%E9%9D%A2%E4%BF%9D%E8%AD%B7%E8%86%A0%E5%B8%B6.png?apikey=viVnb6N20jclO8)
研磨用表面保護膠帶
https://www.toyo-adtec.com.tw
(for after wafer Grinding process, easy to detaping), 500. FUB-150E-XX, PO, Transparent, 150, 20/30, 170/180, 7.50, 0.20, UV types