Detaping：大和產業科技
大和產業科技
Auto De
https://www.csun.com.tw
Wafer Dimension: Diameter: 12″ Thickness: 0.3-2.0mm. Warpage: ±500um; Peeling Module: Peeling Size: 8″/12″ Tape Size: 50mm wide, Max 30mm (3″inner tube) ...
De
https://www.navcore.com.tw
Function. Touch Roller Type; Touch Plate Type; Heating head type; Vacuum Table Angle adjustment; Vacuum Table Heating; Peeling Tape Angle adjustment.
Fully Automatic Detaping System
https://www.jipal.com
Fully Automatic Detaping System. 商品簡述：. Key Features. Full auto tape peeling of QFN devices; Cater for both ambient & high temp. tape peeling up to 250 ...
Kinergy Corporation
https://www.jipal.com
Kinergy Corporation. 首頁 · 產品服務 · 半導體 · Kinergy Corporation · Full Automatic Buffing Machine · Fully Automatic Detaping System ...
撕片機Detaping半導體製程、後工程
https://en.well-orientation.co
撕片機Detaping · More Products · 鋼板檢查機 · 壓模機Auto-Mold System · AOI檢測機台 · UV解膠機 · 清洗機Cleaner · 植球機Ball Mount · 貼片機Taping.
撕片膠帶
https://www.toyo-adtec.com.tw
機器學習如何應用在監測封裝設備上？
https://www.goodtechnology.com
晶圓前段封裝製程順序大致上為：Wafer In → Taping 貼膠→ Wafer Grinding 晶圓研磨→ De-Taping去膠→ Wafer Mount 上框→ UV UV上框→ Wafer Saw ...
研磨用表面保護膠帶
https://www.toyo-adtec.com.tw
(for after wafer Grinding process, easy to detaping), 500. FUB-150E-XX, PO, Transparent, 150, 20/30, 170/180, 7.50, 0.20, UV types