Besi die Bonder：Die Attach
Die Attach
Datacon 2200 evo
https://www.besi.com
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.
Die Bonding
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The Esec 2100 hS is the latest member of the 2100 i Die Bonder family. It is optimized for highest speed and scratch-free transport thanks to the easy-to-use ...
Esec 2100 FC hS
https://www.besi.com
The Flip Chip Bonder Esec 2100 FC hS is the 3rd generation of the market leading High Speed FC platform, capable of running an extensive range of FC ...
Esec 2100 hS
https://www.besi.com
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach ...
Flip Chip
https://www.besi.com
Flip Chip. Besi offers flip chip systems for mass production as well as for the high-end sector, covering a wide range of flip chip processes.
Soft Solder Die Bonding
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Besi Switzerland is a globally leading designer and supplier of fully automated soft solder die attach equipment for the power semiconductor mass market. Its ...