Besi die Bonder：Esec 2100 FC hS
Esec 2100 FC hS
Datacon 2200 evo
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The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.
Die Attach
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Besi offers a wide range of die attach systems based on leading-edge technology. The offering includes multi-chip bonders for advanced packaging, epoxy and soft ...
Die Bonding
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The Esec 2100 hS is the latest member of the 2100 i Die Bonder family. It is optimized for highest speed and scratch-free transport thanks to the easy-to-use ...
Esec 2100 hS
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The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach ...
Flip Chip
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Flip Chip. Besi offers flip chip systems for mass production as well as for the high-end sector, covering a wide range of flip chip processes.
Soft Solder Die Bonding
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Besi Switzerland is a globally leading designer and supplier of fully automated soft solder die attach equipment for the power semiconductor mass market. Its ...