日東uv tape:用於切割製程的UV 放射器NEL 系統™系列
用於切割製程的UV 放射器NEL 系統™系列
特點.供應8吋/6吋框;自動計算UV照射時間;照射區域擴張(至框區);N2淨化;UV照射後核准標記;可使用透過觸控面板&的配方功能,操作簡單;日誌記錄功能標準 ...。其他文章還包含有:「DicingTapeLine」、「ELEPHOLDERELPWS」、「ELEPHOLDERELPWS」、「SemiconductorWaferTapeSWT10T+」、「UVIrradiatorforDicingProcessNELSYSTEM™Series」、「UVIrradiatorforDicingProcessNELSYSTEM™Series」、「切割膠帶產品線ELEPHOLDER」、「半...
查看更多 離開網站Dicing Tape Line
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Low adhesion release and UV release. Outstanding characteristics support the backgrind process of wafer manufacturing.
ELEP HOLDER ELP WS
https://www.nitto.com
適用於半導體晶圓切割製程. ELP WS-01為紫外光固化膠帶,適用於半導體晶圓生産過程中的切割製程。膠帶在照射紫外光前,可在切割過程中將晶圓緊密的固定。
ELEP HOLDER ELP WS
https://www.nitto.com
ELP WS-02T為紫外光固化膠帶,適用於半導體晶圓生産過程中的切割製程。膠帶在照射紫外光前,可在切割過程中將晶圓緊密的固定。而照射紫外光後,可輕易的在上片製程中,將晶 ...
Semiconductor Wafer Tape SWT 10T+
https://www.nitto.com
Low adhesion release and UV release. Outstanding characteristics support the dicing process of wafer manufacturing. Die Attach Film with Pressure Sensitive ...
UV Irradiator for Dicing Process NEL SYSTEM™ Series
https://www.nitto.com
This equipment irradiated UV light to dicing tape on the wafer back side to reduce the adhesion strength . Full-auto type & Semi-auto type machines are ...
UV Irradiator for Dicing Process NEL SYSTEM™ Series
https://www.nitto.com
This equipment irradiated UV light to dicing tape on the wafer back side to reduce the adhesion strength . Full-auto type & Semi-auto type machines are lined up ...
切割膠帶產品線ELEP HOLDER
https://www.nitto.com
可牢固黏貼也能在加熱後輕易剝下;完全適合暫時固定之用。 多用途新固化膠帶. 一種全新的固化膠帶, ...
半導體製程產品
https://www.nitto.com
用於切割製程的UV 放射器NEL 系統™系列. 模造化合物NT Series. No Image ... ELEP HOLDER_Dicing Tape V-8A. 厚度(mm), 0.075. 黏著強度(N), 1.2. 載體類型, - ...