日東uv tape
「日東uv tape」熱門搜尋資訊
「日東uv tape」文章包含有：「DicingTapeLine」、「ELEPHOLDERELPWS」、「ELEPHOLDERELPWS」、「SemiconductorWaferTapeSWT10T+」、「UVIrradiatorforDicingProcessNELSYSTEM™Series」、「UVIrradiatorforDicingProcessNELSYSTEM™Series」、「切割膠帶產品線ELEPHOLDER」、「半導體製程產品」、「用於切割製程的UV放射器NEL系統™系列」
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Dicing Tape Line
https://form.nitto.com
Low adhesion release and UV release. Outstanding characteristics support the backgrind process of wafer manufacturing.
ELEP HOLDER ELP WS
https://www.nitto.com
適用於半導體晶圓切割製程. ELP WS-01為紫外光固化膠帶，適用於半導體晶圓生産過程中的切割製程。膠帶在照射紫外光前，可在切割過程中將晶圓緊密的固定。
ELEP HOLDER ELP WS
https://www.nitto.com
ELP WS-02T為紫外光固化膠帶，適用於半導體晶圓生産過程中的切割製程。膠帶在照射紫外光前，可在切割過程中將晶圓緊密的固定。而照射紫外光後，可輕易的在上片製程中，將晶 ...
Semiconductor Wafer Tape SWT 10T+
https://www.nitto.com
Low adhesion release and UV release. Outstanding characteristics support the dicing process of wafer manufacturing. Die Attach Film with Pressure Sensitive ...
UV Irradiator for Dicing Process NEL SYSTEM™ Series
https://www.nitto.com
This equipment irradiated UV light to dicing tape on the wafer back side to reduce the adhesion strength . Full-auto type & Semi-auto type machines are ...
UV Irradiator for Dicing Process NEL SYSTEM™ Series
https://www.nitto.com
This equipment irradiated UV light to dicing tape on the wafer back side to reduce the adhesion strength . Full-auto type & Semi-auto type machines are lined up ...
切割膠帶產品線ELEP HOLDER
https://www.nitto.com
可牢固黏貼也能在加熱後輕易剝下；完全適合暫時固定之用。 多用途新固化膠帶. 一種全新的固化膠帶， ...
半導體製程產品
https://www.nitto.com
用於切割製程的UV 放射器NEL 系統™系列. 模造化合物NT Series. No Image ... ELEP HOLDER_Dicing Tape V-8A. 厚度（mm）, 0.075. 黏著強度(N), 1.2. 載體類型, - ...
用於切割製程的UV 放射器NEL 系統™系列
https://www.nitto.com
特點. 供應8 吋/ 6 吋框; 自動計算UV 照射時間; 照射區域擴張（至框區）; N2 淨化; UV 照射後核准標記; 可使用透過觸控面板& 的配方功能，操作簡單; 日誌記錄功能標準 ...